Technique for attaching die to leads
AssigneeMicron Technology, Inc.
InventorHugh E. Stroupe
Life of this patent
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Abstract
A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multilayer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.
Claims10
A semiconductor die assembly comprising:
- a semiconductor die having an active surface having a plurality of at least one bond pad thereon;
- a plurality of leads disposed over said semiconductor die extending over said plurality of at least one bond pad;
- and
- an elongated strip of anisotropically conductive elastomeric material comprising a laminate of alternating, substantially parallel sheets of a conductive foil and segments of an insulating elastomer, said elongated strip disposed between said plurality of at least one bond pad of said semiconductor die and said plurality of leads, said sheets of said conductive foil forming a conductive path between said plurality of at least one bond pad and said plurality of leads.
Dependencies are inferred from the claim text.