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US 6,472,698 B1Granted
Solid state image sensor and method for fabricating the same
AssigneeNEC Corporation
InventorYasutaka Nakashiba
Life of this patent
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Abstract
In a solid state image sensor having micro lenses, the micro lens and a bonding pad electrode are formed on a planarizing layer. Thus, it is no longer necessary to etch the planarizing layer for exposing the bonding pad under the planarizing layer, by use of a photolithography, and therefore, it is possible to avoid dissolution, deform and detachment of the micro lens, which would have otherwise been caused in the prior art by dissolving a photoresist which was used in the photolithography.
Claims7
A solid state image sensor comprising:
- a substrate having devices including an image sensor section formed thereon;
- an insulating film covering said devices;
- a light blocking film formed at a predetermined height in a range from a surface of said insulating film to a level within said insulating film, said light blocking film having an opening at a position corresponding to at least said image sensor section;
- a planarizing film covering said insulating film including said light blocking film;
- a groove formed on a top surface in a predetermined region of said planarizing film;
- a bonding electrode filled in said groove and having a surface planarized with said top surface of said planarizing film;
- and
- a micro lens formed on said top surface of said planarizing film at a position corresponding to said image sensor section.
5 more elements
A solid state image sensor comprising:
- a substrate having devices including an image sensor section formed thereon;
- an insulating film covering said devices;
- a light blocking film formed at a predetermined height in a range from a surface of said insulating film to a level within said insulating film, said light blocking film having an opening at a position corresponding to at least said image sensor section;
- a planarizing film covering said insulating film including said light blocking film;
- a bonding metal electrode formed on said planarizing film;
- and
- a micro lens formed on said planarizing film at a position corresponding to said image sensor section.
4 more elements
A solid state image sensor comprising:
- a substrate;
- at least one image sensor section formed on said substrate;
- a planarizing film on top of said at least one image sensor section;
- and
- a bonding electrode located so that a principal surface of said bonding electrode is planar with a top surface of said planarizing film.
2 more elements
Dependencies are inferred from the claim text.