Low-inductance connector for printed-circuit board
AssigneeAmerican Superconductor Corporation
InventorJeffrey A. Reichard
Life of this patent
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Abstract
A low-inductance connection between a first component and a second component on a first surface of a first printed-circuit board includes a second conducting path in electrical communication with a first conducting path that connects the first and second components. The second conducting path is disposed on a surface separated from the first surface of the first printed-circuit board and separated from the first printed-circuit board by an insulating layer. An electrical connector extends between the first conducting path and the second conducting path and provides electrical communication between them. The first and second conducting paths thus cooperate to provide an electrical connection having a parasitic inductance that is smaller than the parasitic inductance of the first conducting path.
Claims52
A low-inductance connection between a first component on a first printed-circuit board and a second component on the first printed-circuit board, the low-inductance connection comprising:
- a first conducting path disposed on a first surface of the first printed-circuit board and extending between the first component and the second component, the first conducting path having a first parasitic inductance;
- and
- a second conducting path disposed on a separate surface, the separate surface being separated from the first surface of the first printed-circuit board by an insulating layer having a selected thickness, the second conducting path being electrically connected to the first conducting path, the first and second conducting paths thereby forming an electrical connection having a second parasitic inductance that is less than the first parasitic inductance.
A method for electrically connecting a first component disposed on a first printed-circuit board and a second component disposed on the first printed-circuit board, the method comprising:
- extending a first conducting path along a first surface of the first printed-circuit board, the first conducting path extending between the first component and the second component and having a first parasitic inductance;
- providing a second conducting path disposed on a separate surface, the separate surface being separated from the first surface of the first printed-circuit board by an insulating layer having a selected thickness;
- and
- providing an electrical connection between the first conducting path and the second conducting path, thereby forming an electrical connection having a second parasitic inductance that is less than the first parasitic inductance.
A power converter comprising:
- a first component on a first surface of a first printed-circuit board;
- a second component on the first surface of the first printed-circuit board;
- a first conducting path disposed on the first surface of the first printed-circuit board and extending between the first component and the second component, the first conducting path having a first parasitic inductance;
- and
- a second conducting path disposed on a separate surface, the separate surface being separated from the first surface of the first printed-circuit board by an insulating layer having a selected thickness, the second conducting path being electrically connected to the first conducting path, the first and second conducting paths thereby forming an electrical connection having a second parasitic inductance that is less than the first parasitic inductance.
Dependencies are inferred from the claim text.