Printed circuit board with embedded thermocouple junctions

An assembly comprising:

• a printed circuit board (PCB) having multiple layers;
• a device mounted onto the PCB;
• and
• a thermocouple junction embedded in one of the multiple layers to provide accurate temperature measurement of heat dissipated from the device, the thermocouple junction comprising:
• a first strip and a second strip of metal on a first layer of the PCB to form a junction having a first strip tail and a second strip tail, the first and second strips of metal being made of different metals,
• a first trace pad and a second trace pad coupled to the thermocouple junction using a first trace and a second trace, the first and second traces being fabricated on a second layer of the PCB, the first trace having a first end and the second trace having a second end, the first end being connected to the first strip tail using a first via and the second end being connected to the second strip tail using a second via, and
• a first wire inserted in the first via and a second wire inserted in the second via to measure a temperature of the PCB.

An assembly comprising:

• a printed circuit board (PCB) having multiple layers;
• a device mounted onto the PCB;
• and
• a thermocouple junction embedded in one of the multiple layers to provide accurate temperature measurement of heat dissipated from the device, the thermocouple junction comprising:
• a first strip and a second strip of metal on a first layer of the PCB to form a junction having a first strip tail and a second strip tail, the first and second strips of metal being made of different metals, and
• a first trace pad and a second trace pad coupled to the thermocouple junction using a first trace and a second trace, the first and second traces being fabricated on a second layer of the PCB, the first trace having a first end and the second trace having a second end, the first end being connected to the first strip tail using a first via and the second end being connected to the second strip tail using a second via.