Semiconductor device
AssigneeNEC Corporation
InventorSadao Nakayama
Life of this patent
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Abstract
The present invention provides a semiconductor device of the BGA configuration comprising: a wiring layer 2 arranged on a circuit substrate 1 via an insulation layer; a land metal portion 2 formed on the wiring layer 2; a solder resist 4 layered so as to cover the land metal excluding a center portion thereof and the entire surface of the circuit substrate 1; and a solder ball 5 arranged on the land metal portion defined and surrounded by the solder resist 4; wherein the land metal portion 3 has a solder ball contact surface having a groove (or a line-shaped protrusion) 7 extending continuously.
Claims6
A semiconductor device of the BGA configuration comprising:
- a circuit substrate;
- a wiring layer arranged on the circuit substrate;
- a land metal portion formed on a part of the wiring layer;
- a solder resist layered so as to cover the land metal excluding a center portion thereof and to cover the entire surface of the circuit substrate excluding the portion of the circuit substrate under the center portion of the land metal;
- a solder ball arranged at the center portion of the land metal portion defined and surrounded by the solder resist;
- wherein the land metal portion has a solder ball contact surface having at least one groove extending for continuous communication.
Dependencies are inferred from the claim text.