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US 6,472,607 B1Granted
Electronic circuit board with known flow soldering warp direction
AssigneeCanon Kabushiki Kaisha
InventorsKeisuke Someya, Akira Okabe
Life of this patent
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Abstract
An electronic circuit board comprising a flow soldering surface and a plurality of lands is disclosed. The flow soldering surface has an upstream side, a downstream side, and a warp defining a warp direction. The plurality of lands are disposed on (i) the upstream side of the flow soldering surface and (ii) the downstream side of the flow soldering surface, and only said plurality of lands on the downstream side having extended portions extending along the warp direction.
Claims6
An electronic circuit board, comprising:
- a flow soldering surface having a warp direction, said flow soldering surface having (i) an upstream side from the warp and (ii) a downstream side from the warp;
- and
- one or more lands disposed on (i) the upstream side of the flow soldering surface and (ii) the downstream side of the flow soldering surface, only said one or more lands on the downstream side having extended portions, the extended portions extending along the warp direction.
An electronic circuit board, comprising:
- a flow soldering surface having a warp direction, said flow soldering surface having (i) an upstream side from the warp and (ii) a downstream side from the warp;
- and
- one or more lands disposed on (i) the upstream side of the flow soldering surface and (ii) the downstream side of the flow soldering surface, only said one or more lands on the downstream side having extended portions, the extended portions extending along the warp direction and formed by thermal expansion during flow soldering of a terminal of a multi-terminal component that includes a connector to the circuit board.
Dependencies are inferred from the claim text.