Electronic parts cleaning solution

An electronic parts cleaning solution comprising a hydroxide, water, a metal corrosion inhibitor, and at least one compound represented by the following general formula (I) or (II):

• HO—((EO)x-(PO)y)z-H (I)
• wherein, EO represents an oxyethylene group, PO represents an oxypropylene group, x and y represent integers satisfying the relation:
• x/(x+y)=0.05 to 0.4, and z represents a positive integer,
• R—[((EO)x-(PO)y)z-H]m (II)
• wherein, EO, PO, x, y and z are the same as in the general formula (I), R represents a residual group obtained by removing a hydrogen atom on a hydroxyl group of alcohol or amine having a hydroxyl group, or a residual group obtained by removing a hydrogen atom on an amino group of amine, and m represents an integer of 1 or more;
• and provided that:
• the metal corrosion inhibitor is a tungsten corrosion inhibitor and comprises at least one selected from the group consisting of compounds containing at least one mercapto group in the molecule, organic compounds containing at least two hydroxyl groups in the molecule, and organic compounds containing at least one hydroxyl group and carboxyl group in the molecule, or the metal corrosion inhibitor is a copper corrosion inhibitor and comprises an aliphatic alcohol based compound which is a compound containing at least one mercapto group in the molecule and in which two or more carbon atoms constitute the compound and a carbon to which a mercapto group is bonded and a carbon to which a hydroxyl group is bonded are adjacent and connected.