Reliable particle removal following a process chamber wet clean

Abstract

Aspects for more reliable particle removal from a semiconductor processing chamber following a chamber wet clean are described. With the present invention, an improved particle removal following wet cleans of semiconductor processing chambers occurs. The present invention creates a turbulent gas flow in a chamber in order to more thoroughly remove particles from the chamber, including those that the wet clean procedures cannot reach. In a straightforward and efficient manner, the turbulent gas flow is created by providing gas in both an upper and lower portion of the chamber substantially simultaneously, including the advantageous use of the backside helium available to chamber processing.

Dependencies are inferred from the claim text.