Method and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies

A method for determining drag forces between a microelectronic-device substrate assembly and polishing pad during mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, comprising:

• moving at least one of the substrate assembly and the polishing pad relative to the other in a planarizing plane to generate lateral drag forces on the substrate assembly and on the pad;
• transferring the lateral drag forces to at least one of a force detection and force measuring assembly;
• measuring lateral drag forces between a first component coupled to one of the substrate assembly or the polishing pad and a second component in either a carrier assembly holding the substrate assembly or a table supporting the polishing pad by measuring a force vector transferred to the at least one of a force detection and force measuring assembly, the lateral drag forces between the first and second components being proportionate to lateral drag forces between the substrate assembly and the polishing pad;
• processing the measured drag force vector to generate a force-time relationship between the lateral drag forces and time;
• and
• assessing exposure of the endpoint layer by monitoring a change from an increasing slope of the force-time relationship to a relatively flat slope.

A method for determining drag forces between a microelectronic-device substrate assembly and polishing pad during mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, comprising:

• moving at least one of the substrate assembly and the polishing pad relative to the other in a planarizing plane to generate lateral drag forces on the substrate assembly and on the pad;
• transferring the lateral drag forces to at least one of a force detection and force measuring assembly;
• generating a drag-force waveform by sensing a drag-force vector transferred to the force detecting or measuring assembly;
• creating a force-time relationship by correlating peak amplitudes of the sensed drag force vector with time;
• monitoring a change from an increasing slope in the force-time relationship to a relatively flat slope;
• and
• terminating planarization of the substrate assembly at an estimated endpoint time defined by a time relative to a change from an increasing slope of the force-time relationship to a relatively flat slope.

A method for determining drag forces between a microelectronic-device substrate assembly and a polishing pad during mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, comprising:

• moving at least one of a substrate assembly relative to a polishing pad to create lateral drag forces;
• transferring the lateral drag forces to an assembly comprising a first component coupled to the substrate assembly or polishing pad and a second component in either a carrier assembly holding the substrate assembly or a table supporting the polishing pad;
• measuring a transferred force vector which is proportional to the lateral drag forces between the substrate assembly and the polishing pad;
• processing the measured transferred force vector to generate a force-time relationship between the drag force vector and time;
• and
• assessing an onset of planarity of the substrate assembly by monitoring a change from an increasing slope in the force-time relationship to a relatively flat slope.

A method for determining drag forces between a microelectronic-device substrate assembly and a polishing pad during mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, comprising:

• moving at least one of the substrate assembly and the polishing pad relative to the other in a planarizing plane to generate lateral drag forces on the substrate assembly and on the pad;
• transferring the lateral drag forces to an at least one of a force detection and force measuring assembly;
• generating a drag force waveform by sensing a force vector which is proportional to a drag force vector extending generally parallel to the planarizing plane;
• processing the waveform to plot peak amplitudes of the waveform over time, the plot having a first section exhibiting an increasing slope and a second section exhibiting a relatively flat slope;
• performing a first regression on the first section to define a first line and a second regression on a second section to define a second line;
• determining an intersection time corresponding to an intersection between the first and second lines;
• estimating an endpoint time of the substrate assembly planarization by adding an over-polish time to the intersection;
• and
• terminating removal of material from the substrate assembly at the estimated endpoint time.