Method of manufacturing bonded structure of film substrate and semiconductor chip

A method of manufacturing a semiconductor device, comprising:

• preparing a semiconductor chip having a plurality of electrodes;
• preparing a substrate on which the semiconductor chip is to be mounted;
• forming connection terminals each having a first end and a second end on one surface of the substrate, said connection terminals being bonded to the substrate with an adhesive layer interposed therebetween;
• bonding the electrodes of the semiconductor chip to the second ends of the connection terminals;
• compressing the electrodes of the semiconductor chip with the second ends of the connection terminals under bonding heat so as to (i) cause portions of the adhesive layer under the second ends of the connection terminals to substantially lose adhesiveness and render free the second ends of the connection terminals, and (ii) thermally elongate the substrate;
• and
• continuing compressing under a temperature lower than the bonding heat so as to:
• (i) cool and alloy the electrodes of the semiconductor chip and the second ends of the connection terminals cooled, and (ii) shrink the substrate;
• whereby the connection terminals are bent together with shrinkage of the substrate such that the second ends of the connection terminals are moved upward so as to balance a weight of the semiconductor chip.