Methods for ball grid array (BGA) encapsulation mold

An encapsulation method in a molding machine for an electronic device mounted on a first side of a planar substrate comprising:

• providing an upper mold plate having a cavity therein and at least one clamping ridge located thereon and a lower mold plate having a cavity therein and at least one clamping ridge located thereon;
• providing apparatus for exerting a force;
• providing a biased floating plate apparatus for providing adjustable compensation for substrates of varying thicknesses, said biased floating plate apparatus having a plurality of spring members;
• mating said upper mold plate and said lower mold plate for enclosing said electronic device and at least a portion of said planar substrate;
• clamping said at least a portion of said planar substrate between said upper mold plate and said lower mold plate using said at least one clamping ridge of said upper mold plate for contacting a portion of said planar substrate and using said at least one clamping ridge of said lower mold plate for contacting a portion of said planar substrate;
• compressing said upper mold plate and said lower mold plate for sealably contacting portions of said planar substrate therebetween using said apparatus for exerting said force;
• compensating for differing thicknesses of said planar substrate using said biased floating plate apparatus for providing adjustable compensation for substrates of varying thicknesses;
• and
• injecting plastic material into said cavities of said upper mold plate and said lower mold plate.