Method for integrated circuit packaging

A method of forming microelectronic packages comprising:

• moving a continuous strip of an electrically conductive substrate material along a feed path;
• removing material from the continuous strip to define a series of successive connected leadframes from the remaining material with each leadframe including a series of leads;
• forming a receptacle of electrically insulative material on the substrate strip proximate each successive leadframe, with each receptacle defining a cavity for receipt of a microelectronic device, and with each receptacle encapsulating the respective leadframe such that the leads of the leadframe extend from the cavity to the exterior of the receptacle to facilitate electrical connection of the microelectronic device to an external circuit;
• and
• attaching a microelectronic in the receptacle.

A method of forming microelectronic packages of the type including a microelectronic device, a receptacle formed of an insulative material and defining a cavity for receipt of the microelectronic device, and a leadframe formed of a conductive material and facilitating electrical connection of the microelectronic device to an external circuit, characterized in that the packages are formed in a continuous process comprising:

• moving a continuous strip of an electrically conductive substrate material along a feed path;
• at a removal station along the feed path, removing material from the continuous strip to define a series of successive connected leadframes from the remaining material with each leadframe including a series of leads;
• at a forming station along the feed path downstream from the removal station, forming a receptacle of electrically insulative material on the substrate strip proximate each successive leadframe with each receptacle defining a cavity for receipt of a microelectronic device, and with each receptacle encapsulating the respective leadframe such that the leads of the leadframe extend from the cavity to the exterior of the receptacle to facilitate electrical connection of the microelectronic device to an external circuit;
• at a plating station along the feed path, plating the continuous strip of substrate in one or more plating baths;
• at a device attachment station along the feed path, securing a microelectronic device within each cavity;
• at a connection station along the feed path, electrically connecting the microelectronic device to the leads positioned within the cavity of each package;
• at a liquid fill station along the feed path, filling each cavity with a liquid encapsulant;
• at a curing station along the feed path, curing the liquid encapsulant;
• at a sealing station along the feed path, covering each package with a lid to seal each package;
• at a marking station along the feed path, marking each package;
• and
• at a separation station along the feed path, separating the continuous strip into discrete sections containing one or more packages.