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US 6,472,250 B1Granted
Method for producing a chip module
AssigneeInfineon Technologies AG
InventorsFrank Püschner, Jürgen Fischer, Erik Heinemann
Life of this patent
Estimating the term…
Abstract
A method for producing a chip module includes punching a chip carrier to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots defining a given distance. The given distance is subsequently reduced to a dimension preventing a flow through of a sealing mass by a swaging operation carried out at least in a region close to the slots.
Claims6
A method for producing a chip module, which comprises:
- punching a metal chip carrier to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots defining a given distance;
- subsequently reducing the given distance between the chip carrier fixing section and the chip carrier contact sections to a given dimension by a swaging operation carried out at least in a region close to the slots;
- placing an electronic chip on the chip carrier fixing section;
- leading terminal wires of the chip to the chip carrier contact sections;
- and
- encapsulating the chip along with the terminal wires on the chip carrier with a sealing mass prevented from flowing through the slots by the given dimension.
3 more elements
A method for producing a chip module, which comprises:
- punching a metal chip carrier having first and second opposite sides to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots;
- subsequently forming a depression into a region adjacent the slots on the first side of the chip carrier by a swaging operation defining a receiving space;
- placing an electronic chip on the chip carrier fixing section on the second side of the chip carrier;
- leading terminal wires of the chip to the chip carrier contact sections;
- and
- encapsulating the chip along with the terminal wires on the chip carrier with a sealing mass passing through the slots into the receiving space.
3 more elements
Dependencies are inferred from the claim text.