Solid-state imaging device and method of production of the same

A method of production of a solid-state imaging device, comprising the steps of:

• providing a solid-state image sensor having an effective light-receiving region on a circuit formation surface provided in a face-down condition;
• providing a transparent substrate having a conductor pattern provided thereon to confront the circuit formation surface of the image sensor;
• providing a plurality of bumps on one of the image sensor and the substrate;
• moving the image sensor closer to the substrate until a predetermined distance between the image sensor and the substrate is reached, so that the bumps interconnect the image sensor and the conductor pattern of the substrate;
• supplying a predetermined amount of a transparent adhesive agent between the image sensor and the substrate after the predetermined distance is reached in the moving step, the amount of the adhesive agent being large enough to fully cover the light-receiving region of the image sensor;
• forming the adhesive agent between the image sensor and the substrate into a thin layer, the thin layer of the adhesive agent covering the light-receiving region of the image sensor;
• and
• curing the adhesive agent.