Method of adhering a wafer to wafer tape
AssigneeTexas Instruments Incorporated
InventorsRobert G. McKenna, R. Scott Croff
Life of this patent
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Abstract
A method and apparatus (10) for securing a fragile wafer (16) to a wafer tape (26) secured taut across a wafer frame (24). A gentle point force (72) is provided by a roller wheel (36) mounted on a rotatable arm (30) to securely adhere the wafer tape (26) to the backside of the wafer (16). Preferably, a spiral pattern (70) is formed by the rotating roller (36) to secure the wafer tape (26) to the wafer (16) to avoid forming air bubbles or creases between the wafer tape and wafer. The method and apparatus is especially suitable for securely adhering fragile wafers to wafer tape that are to be subsequently broken along kerfs.
Claims10
A method of securing a wafer to a flexible adhesive membrane having an adhesive first surface and an opposing second surface, comprising the steps of:
- a) placing a wafer proximate said adhesive first surface;
- and
- b) directing a point force against said membrane second surface proximate said wafer to increase adhesion of said membrane adhesive first surface to said wafer.
Dependencies are inferred from the claim text.