Substrate supporting carrier pad

A carrier head assembly of a substrate polishing apparatus, comprising:

• a substrate confining ring and a pressure exerting, substrate supporting carrier pad adapted for assembly within the substrate confining ring, the carrier pad being in the form of a hollow, sealed, hollow, fluid filled chamber that can be used in concert with a fluid providing surface tension adhesion of a substrate to be polished, the chamber further being adapted to be compressed by a down force, and become internally pressurized with a uniform internal pressure that uniformly distributes the down force over the backside of a supported substrate to be polished, and the carrier pad having a substrate receiving recess.

A carrier head assembly of a substrate polishing apparatus, comprising:

• a substrate confining ring and a pressure exerting, substrate supporting carrier pad adapted for assembly within the substrate confining ring, the carrier pad being in the form of a hollow, sealed, hollow, fluid filled chamber that can be used in concert with a fluid providing surface tension adhesion of a substrate to be polished, the chamber further being adapted to be compressed by a down force, and become internally pressurized with a uniform internal pressure that uniformly distributes the down force over the backside of a supported substrate to be polished, the carrier pad having a perimeter wall united with a substrate supporting platen wall, and the perimeter wall being offset outward from an area of the platen wall that supports an edge margin of a substrate to be supported by the platen wall.

A substrate supporting carrier pad comprising:

• a hollow, sealed, hollow, fluid filled chamber adapted to be compressed by a down force during a substrate polishing operation to become internally pressurized with a uniform internal pressure that uniformly distributes a down force over the backside of a supported substrate to be polished, the chamber having a substrate supporting platen wall for supporting a substrate, a rear wall and a perimeter wall united with the platen wall and the rear wall, and the rear wall being fabricated of a first polymer having a hardness greater than a second polymer of which said platen wall is fabricated.

A substrate supporting carrier pad comprising:

• a hollow, sealed, fluid filled chamber adapted to be compressed by a down force during a substrate polishing operation to become internally pressurized with a uniform internal pressure that uniformly distributes a down force over the backside of a supported substrate to be polished, and at least one fluid transmitting passage through the carrier pad, said passage extending from the rear wall to the platen wall and being surrounded by an interior web.

A substrate supporting carrier pad comprising:

• a hollow, sealed, hollow, fluid filled chamber adapted to be compressed by a down force during a substrate polishing operation to become internally pressurized with a uniform internal pressure that uniformly distributes a down force over the backside of a supported substrate to be polished, and internal perforated reinforcing webs joined to the substrate supporting platen wall.

A substrate supporting carrier pad comprising:

• a hollow, sealed, hollow, fluid filled chamber adapted to be compressed by a down force during a substrate polishing operation to become internally pressurized with a uniform internal pressure that uniformly distributes a down force over the backside of a supported substrate to be polished, and a substrate receiving recess in the substrate supporting platen wall.

A substrate supporting carrier pad comprising:

• a hollow, sealed, hollow, fluid filled chamber adapted to be compressed by a down force during a substrate polishing operation to become internally pressurized with a uniform internal pressure that uniformly distributes a down force over the backside of a supported substrate to be polished, and the substrate supporting platen wall having a substrate receiving recess, and a substrate receiving O-ring against a perimeter of the substrate receiving recess.

A substrate supporting carrier pad comprising:

• a hollow, sealed, hollow, fluid filled chamber adapted to be compressed by a down force during a substrate polishing operation to become internally pressurized with a uniform internal pressure that uniformly distributes a down force over the backside of a supported substrate to be polished, and the perimeter wall being offset outward from an area of the platen wall that supports an edge margin of a substrate to be supported by the platen wall.

A substrate supporting carrier pad comprising:

• a hollow, sealed, hollow, fluid filled chamber adapted to be compressed by a down force during a substrate polishing operation to become internally pressurized with a uniform internal pressure that uniformly distributes a down force over the backside of a supported substrate to be polished, and interior webs supporting the carrier pad and resisting collapse of the carrier pad.

A substrate supporting carrier pad comprising:

• a hollow, sealed, hollow, fluid filled chamber adapted to be compressed by a down force during a substrate polishing operation to become internally pressurized with a uniform internal pressure that uniformly distributes a down force over the backside of a supported substrate to be polished, at least one passage extending through the carrier pad, and said passage being surrounded by an interior web supporting the carrier pad and resisting collapse of the carrier pad.