Sacrificial retaining ring CMP system and methods for implementing the same

A wafer holding and application apparatus for use in chemical mechanical polishing (CMP) applications, the apparatus comprising:

• a carrier head;
• a retaining ring support being attached to the carrier head;
• a sacrificial retaining ring being attached to the retaining ring support, the sacrificial retaining ring being configured to confine a wafer at a desired location when applied to a polishing surface by the carrier head, the sacrificial retaining ring being defined from a material that approximates the wafer, and a contact surface of the sacrificial retaining ring configured to simulate a pattern of a to be polished surface of the wafer being positioned approximately planar with the to be polished surface of the wafer.

A carrier head having a retaining ring structure, the carrier head being configured for use in a chemical mechanical polishing system (CMP), comprising:

• a retaining ring support;
• and
• a sacrificial retaining ring having an upper surface and a contact surface, the sacrificial retaining ring defined from a material having substantially the same characteristics as a material defining a top surface of a substrate being polished, wherein the upper surface is configured to be attached to the retaining ring support, such that the retaining ring support holds the sacrificial retaining ring, and wherein the contact surface of the sacrificial retaining ring configured to simulate a pattern of a top surface of the substrate being polished is configured to be substantially planer with the top surface of the substrate being polished.