Mold for fabricating semiconductor devices

A mold for use for fabricating a semiconductor device, comprising:

• an upper mold;
• and
• a lower mold disposed so as to face said upper mold,
• said lower mold comprising:
• a base block adapted to be mounted on a press head;
• a center block provided on said base block;
• an inner die provided on said center block so as to face said upper mold, said inner die supporting thereon a semiconductor substrate including therein a semiconductor device having a bump electrode;
• a guide ring provided so as to surround said center block laterally, said guide ring being movable relatively to said center block in a direction of a force exerted by said upper mold when conducting a press-molding process;
• an outer die provided on said guide ring so as to face said upper mold;
• and
• a rolling body disposed in a gap between an outer periphery of said center block and an inner periphery of said guide ring,
• said upper mold having a bearing mechanism, said bearing mechanism including a spherical bearing surface, said upper mold pressing a resin tablet disposed on said semiconductor substrate to form a resin layer covering a surface of said semiconductor substrate with a thickness of 100 μm or less.