Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsIssei Ueda, Shinichi Hayashi, Naruaki Iida, Yuji Matsuyama, Yoichi Deguchi
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Abstract
Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrate temperature regulation processing on a drop in throughput can be reduced greatly by transferring the wafer W while the temperature of the wafer W is being regulated by a temperature regulation and transfer device.
Claims13
A substrate processing apparatus, comprising:
- a main transfer section for transferring a substrate:
- temperature regulating sections, disposed around said main transfer section in at least two directions facing each other out of four directions, for receiving and sending the substrate from/to said main transfer device and regulating the temperature of the substrate at a predetermined temperature:
- a thermal processing section for processing the substrate at a temperature not less than the predetermined temperature;
- and
- moving means for moving said temperature regulating section to deliver the substrate from/to said temperature regulating section to/from said thermal processing section.
A substrate processing apparatus, comprising:
- a temperature regulating section for regulating the temperature of a substrate at a predetermined temperature;
- a temperature regulation and transfer mechanism for regulating the temperature of the substrate at a predetermined temperature and transferring the substrate;
- and
- a main transfer section for receiving and sending the substrate from/to said temperature regulating section and said temperature regulation and transfer mechanism.
A substrate processing apparatus, comprising:
- a processing section for performing thermal processing for a substrate;
- a temperature regulation and transfer mechanism for regulating the temperature of the substrate at a predetermined temperature and transferring the substrate from/to said processing section;
- and
- a fist and a second main transfer section, disposed on both sides of said temperature regulation and transfer mechanism, for transferring the substrate from/to said temperature regulation and transfer mechanism.
A substrate processing method, comprising the steps of:
- delivering a substrate from a main transfer section for transferring the substrate to a temperature regulation and transfer section;
- transferring the substrate to a processing section while regulating the temperature of the substrate at a predetermined temperature by the temperature regulation and transfer section;
- and
- subjecting the transferred substrate to thermal processing in the processing section.
A substrate processing apparatus, comprising:
- a first processing unit group in which first processing units each for supplying a predetermined solution onto a substrate to perform solution processing are stacked in multiple tiers;
- a second processing unit group in which second processing units, in which a heating section for performing heat processing for the substrate and a temperature regulating section for performing temperature regulation processing for the substrate are disposed adjacent to each other and integrated, are stacked in multiple tiers;
- and
- a transfer device for transferring the substrate between the first processing units and the second processing units,
- said first processing unit group and said second processing unit group being disposed adjacent to each other so that the temperature regulating section out of the heating section and the temperature regulating section in each of the second processing units is positioned on said first processing unit group side.
A substrate processing apparatus, comprising:
- a first processing unit group in which first processing units each for supplying a predetermined solution onto a substrate in multiple tiers;
- a second processing unit group in which second processing units, in which a heating section for performing heat processing for the substrate and a temperature regulating section for performing temperature regulation processing for the substrate are disposed adjacent to each other and integrated, are stacked in multiple tiers;
- and
- an exposure unit for performing exposure processing for the substrate which has undergone the solution processing,
- wherein the substrate is kept waiting in the temperature regulating section of the second processing unit before being carried into said exposure unit.
Dependencies are inferred from the claim text.