US 6,471,415 B1 · Multiconductor interconnect

Abstract

A space saving interconnect having a plurality of conductors. To decrease the width of a selected portion of the interconnect, the conductors are split between two or more layers. One group the conductors extend along a portion of a first layer jumping to and continuing along a second layer. The remaining conductors extend only along the first layer. Consequently, the width of the interconnect where the conductors are split between the layers can be substantially reduced. In one exemplary embodiment, the first layer is characterized by a first section having only first conductors and a second section having both the first second conductors. The first conductors in the first section of the first layer span a first width and the first and second conductors in the second section of the first layer span a second width greater than the first width. The second layer includes third conductors extending between first and second sections of the second layer. The third conductors in the first section of the second layer span a third width, and the third conductors in the second section of the second layer span a fourth width.

Claims22

Dependent claims

A multiconductor interconnection kit, comprising:

a first layer comprising first conductors and second conductors, the first layer characterized by a first section having only the first conductors and a second section having both the first and second conductors, the first conductors in the first section of the first layer spanning a first width and the first and second conductors in the second section of the first layer spanning a second width greater than the first width;
and
a second layer comprising third conductors extending between first and second sections of the second layer, the third conductors in the first section of the second layer spanning a third width and the third conductors in the second section of the second layer spanning a fourth width greater than the third width.

A transducer head multiconductor interconnect, comprising:

a transducer head having a media bearing surface with one or more read/write elements disposed thereon and a plurality of conductive traces coupling the read/write elements to a plurality of connection points;
a first multiconductor layer having first and second sections;
a second multiconductor layer having a first and second sections, the first section of the second layer located adjacent to the first section of the first layer and the second section of the second layer located adjacent to the second section of the first layer;
first conductors extending between the first and second sections of the first layer each having a connection point in the first section of the first layer;
second conductors in the second section of the first layer each having a connection point in the second section of the first layer;
third conductors in the second layer each having connection points in the first and second sections of the second layer;
fourth conductors each coupling one connection point in the second section of the first layer to one connection point in the second section of the second layer;
and
fifth conductors each coupling one connection point in the first section of the first layer or one connection point in the first section of the second layer to one connection point on the transducer head.

6 more elements

Dependencies are inferred from the claim text.

Multiconductor interconnect

Life of this patent

Multiconductor interconnect

Life of this patent

Abstract

Claims22