Method and apparatus for mounting semiconductor chips
AssigneeESEC Trading SA
InventorsChristoph Luechinger, Markus Limacher
Life of this patent
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Abstract
With the mounting of semiconductor chips on a substrate having a solder portion a semiconductor chip held by a gripper spring mounted on a bondhead is lowered onto the substrate. In doing so, the gripper is deflected towards the bondhead. Subsequently, the semiconductor chip is raised by a predetermined distance and then released. Optionally, the semiconductor chip is moved up and down before being released. With this method, the semiconductor chip is under mechanical control until the solder has taken up a stable form and the semiconductor chip has achieved its final position.
Claims8
Method for mounting a semiconductor chip on a substrate having a solder portion, the method comprising the following steps:
- a) Presenting the substrate on a support;
- b) Grasping the semiconductor chip by means of a gripper spring mounted on a bondhead;
- c) Lowering the semiconductor chip onto the substrate, whereby the gripper carrying the semiconductor chip is deflected towards the bondhead;
- d) Raising the semiconductor chip by a predetermined distance;
- e) Releasing the semiconductor chip, and
- f) Moving the bondhead away.
Apparatus for mounting semiconductor chips onto a substrate having a solder portion with a bondhead with a gripper for grasping a semiconductor chip, whereby the gripper is deflectable towards the bondhead and wherein a sensor is present which indicates whether the gripper is deflected.
Dependencies are inferred from the claim text.