US 6,471,109 B2 · Method and apparatus for soldering and soldering land of a printed circuit board

Abstract

A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.

Claims7

Dependent claims

A soldering apparatus for soldering for a work during conveyance thereof, said soldering apparatus comprising:

a movable member to which a pair of soldering irons are attached at a predetermined interval;
actuating means for moving said movable member in a reciprocating manner, said actuating means adapted to simultaneously cause one of said soldering irons to be set at a working position for soldering and the other of said soldering irons to be set at a cleaning position for cleaning;
and
cleaning means for cleaning one of said soldering irons set at said cleaning position, said cleaning means being operated while the other of said soldering irons set at said working position performs soldering.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

09/912,311Filed 26 Jul 2001 · division

Priority

JP 9-0201593 Feb 1997

Published

US 2001/0045444 A129 Nov 2001

Granted

29 Oct 2002

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

B23K 1/0016
Specially adapted for particular articles or work: soldering of electronic components
H05K 1/116
Via connections; Lands around holes or via connections: lands, clearance holes or other lay-out details concerning the surrounding of a via
H05K 3/3447
By soldering: lead-in-hole components
B23K 2101/42
Electric or electronic devices: printed circuits

Family

Application09/014,567Parent of this division · filed 28 Jan 1998

Application09/499,761Parent of this division · filed 8 Feb 2000

US 2001/0045444 A1Pre-grant publication · published 29 Nov 2001

US 6,290,118 B1Parent of this division

US 6,045,025 AParent of this division

US 6,471,109 B2This patent

From the US filing history. Foreign family members aren’t listed.

Method and apparatus for soldering and soldering land of a printed circuit board

Life of this patent

Method and apparatus for soldering and soldering land of a printed circuit board

Life of this patent

Abstract

Claims7