Multilayer chip slapper
AssigneePerkinElmer, Inc.
InventorsBarry T. Neyer, Robert Tomasoski, Robert Tetreault, George Papadopoulos
Life of this patent
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Abstract
A chip slapper including a substrate, a sticking layer on the substrate, a conductive layer on the sticking layer in the shape of two lands separated by a bridge portion between the two lands, a buffer material on the conductive layer, a protective coating on the buffer layer extending across at least a substantial portion of the two lands but absent from the bridge portion, and a flyer layer over the bridge portion. The buffer layer prevents migration of the material of the coating into the material of the conductive layer and vice versa and better adheres the flyer layer on the bridge portion where the coating is absent.
Claims29
A chip slapper comprising:
- a substrate;
- a sticking layer on the substrate;
- a conductive layer on the sticking layer in the shape of two lands separated by a bridge portion between the two lands;
- a buffer material on the conductive layer;
- a coating on the buffer layer extending across at least a substantial portion of the two lands but absent from the bridge portion;
- and
- a flyer layer over the bridge portion such that the buffer material prevents migration of the material of the coating into the material of the conductive layer and vice versa and adheres the flyer layer on the bridge portion where the coating is absent.
A chip slapper comprising:
- a substrate;
- a conductive layer on the substrate in the shape of two lands separated by a bridge portion between the two lands;
- a coating on the lands of the conductive layer but absent from the bridge portion;
- and
- a flyer layer over the bridge portion.
A chip slapper comprising:
- a substrate;
- a conductive layer on the substrate in the shape of two lands separated by a bridge portion between the two lands;
- a buffer material on at least the bridge portion of the conductive layer;
- and
- a flyer layer over the bridge portion such that the buffer layer promotes adhesion of the flyer layer to the conductive layer.
A method of making a chip slapper, the method comprising:
- depositing a sticking layer on a substrate;
- depositing a conductive layer on the sticking layer;
- depositing a buffer material on the conductive layer;
- coating the conductive layer;
- etching the sticking layer, the conductive layer, the buffer layer, and the coating into the shape of two lands separated by a bridge portion between the two lands;
- removing the coating from the bridge portion to reveal the buffer material;
- and
- attaching a flyer layer to the bridge portion.
Dependencies are inferred from the claim text.