Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate
AssigneeNational Semiconductor Corporation
InventorShaul Branchevsky
Life of this patent
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Abstract
Embedded green multi-layer ceramic capacitors in low-temperature co-fired ceramic (LTCC) substrates are provided. A first set of electrodes is printed on a ceramic tape. A first dielectric layer is placed over the first set of electrodes and the ceramic tape. A second set of electrodes is printed on the first dielectric layer. A second dielectric layer is placed over the second set of electrodes and the first dielectric layer. A third set of electrodes is printed on the second dielectric layer. The sheet is then cut to form separate green multi-layer ceramic capacitor chips. The green multi-layer ceramic capacitor chips are then placed in a cavity formed by ceramic tape.
Claims16
A method of providing an embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate formed by at least one layer of ceramic tape, the method comprising:
- forming a plurality of multi-layer capacitors in a sheet;
- cutting the sheet to form some of the plurality of multi-layer capacitors into a plurality of multi-layer capacitor chips;
- forming a plurality of connector electrodes, comprising:
- forming a plurality of vias in the ceramic substrate;
- and
- filling the vias with a paste of conductive material;
- forming at least one cavity in the ceramic substrate by punching in at least one layer of ceramic tape
- placing at least one multi-layer capacitor chip of the plurality of multi-layer capacitor chips into the at least one cavity in the ceramic substrate.
Dependencies are inferred from the claim text.