Method for forming a semiconductor device having a metallic substrate
AssigneeUni Light Technology Inc.
InventorsNai-Chuan Chen, Bor-Jen Wu, Yuan-Hsin Tzou, Nae-Guann Yih, Chien-An Chen
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Abstract
The present invention provides a method for forming a semiconductor device with a metallic substrate. The method comprises providing a semiconductor substrate. At least a semiconductor layer is formed on the semiconductor substrate. A metallic electrode layer is formed on the semiconductor layer. The metallic substrate is formed on the metallic electrode layer and the semiconductor substrate is removed. The metallic substrate has advantages of high thermal and electrical conductivity, that can improve the reliability and life-time of the semiconductor device.
Claims28
A method for forming a semiconductor device with a metallic substrate, said method comprising:
- providing a semiconductor substrate;
- forming at least a semiconductor layer on said semiconductor substrate;
- forming a metallic electrode layer on said semiconductor layer;
- forming said metallic substrate on a surface of said metallic electrode layer;
- and
- removing said semiconductor substrate.
A method for forming an optical semiconductor device, said method comprising:
- providing a semiconductor substrate;
- forming at least a semiconductor layer on said semiconductor substrate;
- forming a metallic electrode layer on said semiconductor layer;
- forming a first metallic substrate on a surface of said metallic electrode layer;
- removing said semiconductor substrate;
- and
- forming a second metallic substrate on said semiconductor layer.
A method for forming a light emitting diode (LED) having a metallic substrate, said method comprising:
- providing a semiconductor substrate;
- epitaxially growing a lamination of LED layers on said semiconductor substrate;
- forming a metallic electrode layer on said lamination of LED layers;
- forming a metallic substrate on a surface of said metallic electrode layer;
- and
- removing said semiconductor substrate.
Dependencies are inferred from the claim text.