US 6,468,363 B2Granted

Composition for increasing activity of a no-clean flux

AssigneeInternational Business Machines Corporation

InventorsDonald W. Henderson, James Spalik

Life of this patent

Estimating the term…

Abstract

An activated no-clean flux composition for soldering includes a dicarboxylic acid, an organic solvent, and acetic acid in the range of about 2% to about 4% by weight.

Claims5

Dependent claims

A no-clean flux composition for use in soldering, said no-clean flux composition consisting essentially of:

pimelic acid comprising about 4.5% by weight of said composition;
an organic solvent;
and
acetic acid comprising about 2% by weight of said composition.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 09/773,488Filed 2 Feb 2001 · continuation
Priority: 14 Dec 1999
Published: US 2001/0025673 A14 Oct 2001
Granted: 22 Oct 2002
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

B23K 35/3618
With organic compounds as principal constituents: carboxylic acids or salts
B23K 35/3612
Selection of non-metallic compositions, e.g. coatings or fluxes ; Selection of soldering or welding materials, conjoint with selection of…: with…
B23K 35/3617
With organic compounds as principal constituents: b-compounds
H05K 3/3489
By soldering: composition of fluxes; Application thereof; Other processes of activating the contact surfaces

Family

Application09/461,557Parent of this continuation · filed 14 Dec 1999
US 2001/0025673 A1Pre-grant publication · published 4 Oct 2001
US 6,217,671 B1Parent of this continuation
US 6,468,363 B2This patent

From the US filing history. Foreign family members aren’t listed.

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