Adhesive film of quinoline polymer and bismaleimide
AssigneeHitachi Chemical Company, Ltd.
InventorsMasahiro Suzuki, Shin Nishimura, Masao Suzuki, Akio Takahashi, Akira Kageyama, Yoshihiko Honda, Toshiyasu Kawai, Shinji Iioka, Yoshihiro Nomura
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Abstract
A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6′-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4′-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-maleimidophenoxy)phenyl)propane.
Claims15
An adhesive film comprising a resin composition that comprises
- (A) a polymer containing a quinoline ring represented by the following formula (1) in thestructure, and
- (B) a bismaleimide compound represented by the following formula (2):
- wherein Ar represents a divalent organic group containing at least two carbon atoms, and
- wherein the adhesive film has a thickness of 1 to 100 μm.
Dependencies are inferred from the claim text.