Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device
AssigneesKabushiki Kaisha Toshiba, Jsr Corporation
InventorsHiroyuki Yano, Gaku Minamihaba, Yukiteru Matsui, Katsuya Okumura, Masayuki Motonari, Masayuki Hattori, Akira Iio
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Abstract
A process for chemical mechanical polishing of a working film on a wafer, which entails conducting the chemical mechanical polishing with an aqueous dispersion containing water and composite particles, the composite particles containing polymer particles having at least one of a silicon compound portion or section and a metal compound portion or section formed directly or indirectly on the polymer particles.
Claims37
A process for chemical mechanical polishing of a working film on a wafer, which comprises effecting said chemical mechanical polishing with an aqueous dispersion composition comprising water and composite particles, said composite particles comprising polymer particles having at least one of a siloxane bond-containing section and a metal compound section directly or indirectly on said polymer particles;
- said metal compound section being selected from the group consisting of a metalloxane bond-containing section, an alumina particle section, ceria particle section, and a zirconia particle section.
An aqueous chemical mechanical polishing dispersion composition which comprises water and composite particles comprising polymer particles having at least one of a siloxane bond-containing section and a metal compound section directly or indirectly on said polymer particles;
- said metal compound section being selected from the group consisting of a metalloxane bond-containing section, an alumina particle section, ceria particle section, and a zirconia particle section.
Dependencies are inferred from the claim text.