Packaging architecture for 32 processor server
AssigneeHewlett-Packard Company
InventorsLisa Heid Pallotti, Eric C. Peterson, Christian L Belady, Terrel L. Morris, Michael C. Day
Life of this patent
Estimating the term…
Loading patent…
AssigneeHewlett-Packard Company
InventorsLisa Heid Pallotti, Eric C. Peterson, Christian L Belady, Terrel L. Morris, Michael C. Day
Estimating the term…
The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.
A multi-processor computer system comprising:
A cell board for a multi-processor computer system, wherein the cell board comprises:
A multi-processor computer system comprising:
Dependencies are inferred from the claim text.