Illumination system and exposure apparatus and method

A method for manufacturing a semiconductor device, comprising the steps of:

• providing a light beam;
• dividing a wavefront of the light beam into a plurality of arcuate light beams;
• directing said plurality of arcuate light beams to a mask;
• and
• projecting an image of a pattern formed on the mask onto a photosensitive substrate.

An illumination system for forming an illumination field on an object surface, comprising:

• a light source to provide a light beam;
• a first optical array in an optical path between said light source and the object surface, said first optical array including a plurality of first reflecting surfaces each having a first shape when viewed in a direction along an optical axis of the first reflecting surfaces;
• and
• a second optical array in the optical path between said first optical array and the object surface, said second optical array including a plurality of second reflecting surfaces each having a second shape when viewed in a direction along an optical axis of the second reflecting surfaces, the second shape being different from said first shape.

A method for manufacturing a semiconductor device, comprising the steps of:

• providing a light beam;
• directing the light beam to a mask by using a first optical array including a plurality of first reflecting surfaces and a second optical array including a plurality of second reflecting surfaces, the plurality of first reflecting surfaces each having a first shape when viewed along an optical axis of the first reflecting surfaces, the plurality of second reflecting surfaces each having a second shape when viewed along an optical axis of the second reflecting surfaces, the second shape being different from said first shape;
• and
• projecting an image of a pattern formed on the mask onto a photosensitive substrate.

An exposure apparatus for exposing an image of a pattern formed on a mask onto a photosensitive substrate, comprising:

• an illumination system to illuminate the mask with a light beam having wavelength λ<200 nm;
• said illumination system comprising a plurality of reflecting members disposed to direct the light beam to the mask;
• a projection optical system in an optical path between the mask and the photosensitive substrate, said projection optical system comprising a plurality of reflecting members disposed to direct the light beam from the mask to the photosensitive substrate;
• and
• an illumination changing system disposed within said illumination system so as to change a light intensity distribution at a pupil of said projection optical system.

A method for manufacturing a semiconductor device, comprising the steps of:

• illuminating a mask with a light beam having wavelength λ<200 nm by using an illumination system including a plurality of reflecting members;
• exposing an image of a pattern formed on a mask onto a photosensitive substrate by using a projection optical system including a plurality of reflecting members;
• and
• wherein said illuminating step comprises the step of:
• changing a light intensity distribution at a pupil of said projection optical system.

An exposure apparatus for exposing an image of a pattern formed on a mask onto a photosensitive substrate, comprising:

• an illumination system to illuminate the mask with a light beam having wavelength λ<200 nm;
• said illumination system comprising a plurality of reflecting members disposed to direct the light beam to the mask;
• a projection optical system in an optical path between the mask and the photosensitive substrate, said projection optical system comprising a plurality of reflecting members disposed to direct the light beam from the mask to the photosensitive substrate;
• and
• a light intensity distribution changing system disposed within and illumination system so as to change a light intensity distribution at the photosensitive substrate.

A method for manufacturing a semiconductor device, comprising the steps of:

• illuminating a mask with a light beam having wavelength λ<200 nm by using an illumination system including a plurality of reflecting members;
• exposing an image of a pattern formed on a mask onto a photosensitive substrate by using a projection optical system including a plurality of reflecting members;
• and
• wherein said illuminating step comprises the step of:
• changing a light intensity distribution at the photosensitive substrate.

An exposure apparatus for exposing an image of a pattern formed on a mask onto a photosensitive substrate, comprising:

• an illumination system to illuminate the mask with a light beam having wavelength λ<200 nm;
• said illumination system comprising a plurality of reflecting members disposed to direct the light beam to the mask;
• a projection optical system in an optical path between the mask and the photosensitive substrate, said projection optical system comprising a plurality of reflecting members disposed to direct the light beam from the mask to the photosensitive substrate;
• an illumination changing system disposed within said illumination system so as to change a light intensity distribution at a pupil of said projection optical system;
• and
• a light intensity distribution changing system disposed within said illumination system so as to change a light intensity distribution at the photosensitive substrate.

A method for manufacturing a semiconductor device, comprising the steps of:

• illuminating a mask with a light beam having wavelength λ<200 nm by using an illumination system including a plurality of reflecting members;
• exposing an image of a pattern formed on the mask onto a photosensitive substrate by using a projection optical system including a plurality of reflecting members;
• and
• wherein said illuminating step comprises the steps of:
• changing a light intensity distribution at a pupil of said projection optical system, and
• changing a light intensity distribution at the photosensitive substrate.