Polyolefin/copolyamide RF active adhesive film
AssigneeDow Global Technologies LLC
InventorRobert H. Kelch
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Abstract
Flexible, halogen-free, high frequency-sealable films fabricated from a blend of a copolyamide and a polyolefin having a carboxylic acid or carboxylic acid anhydride functionality have sufficient copolyamide to yield a DLF of at least 0.05 at a frequency of 27 megahertz and serve as effective substitutes for flexible polyvinyl chloride films. The films may be mono-layer films or multi-layer films, especially where the high frequency-sealable films serve as outer or skin layers in multi-layer films. Products made from such monolayer and multi-layer films find utility in a number of applications, especially for medical device applications.
Claims8
A polymeric composition suitable for fabrication into a radio frequency weldable film structure, the composition consisting essentially of a blend of a copolyamide and an RF inactive polyolefin that has a carboxylic acid functionality and an acid comonomer content of at least three weight percent, based on total polyolefin weight, the blend having a dielectric loss factor of at least 0.05 at a frequency of 27 megahertz at 23° centigrade, the copolyamide being present in an amount within a range of from 35 to less than 60 percent by weight, based on total blend weight;
- wherein the RF inactive polyolefin with carboxylic acid functionality has a melt index of 0.5 to 300 grams per 10 minutes (190° C., 2.16 Kg) according to ASTM D-1238.
Dependencies are inferred from the claim text.