Positive photosensitive composition
AssigneeFuji Photo Film Co., Ltd.
InventorKazuto Kunita
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Abstract
The present invention relates to a positive photosensitive composition, and in particular to a material for plate printing for heat mode printing. The positive photosensitive composition of the present invention comprises at least a diazo compound represented by the following General Formula 1, and a water-insoluble but alkaline water-soluble polymer: (where Z represents an organic group in which the pKa of dissociating H in Ph—NH—Z is 14 or less; and Q1 and Q2 represent organic groups, where Q1 and Q2 may be bonded to form an aliphatic ring or aromatic ring).
Claims23
A positive photosensitive composition, comprising at least a diazo compound represented by the following General Formula 1, and a water-insoluble but alkaline water-soluble polymer:
- wherein z represents an organic group in which the pKa of dissociating H in Ph—NH—Z is no more than 14, and Q1 and Q2 represent organic groups, where Q1 and Q2 may be bonded to form an aliphatic ring or aromatic ring and wherein when Z is —SO2R1, R1 is a terminal group.
A positive photosensitive composition that is sensitive to a heat mode laser, comprising at least a diazo compound represented by General Formula 1, and a water-insoluble but alkaline water-soluble polymer:
- wherein z represents an organic group in which the pKa of dissociating H in Ph—NH—Z is no more than 14, and Q1 and Q2 represent organic groups, where Q1 and Q2 may be bonded to form an aliphatic ring or aromatic ring and wherein when Z is —SO2R1, R1 is a terminal group.
A diazo compound represented by the following general Formula 1:
- wherein Z represents an organic group in which the pKa of dissociating H in Ph—NH—Z is no more than 14, and Q1 and Q2 represent organic groups, where Q1 and Q2 are bonded to form an aromatic ring and wherein when Z is —SO2R1, R1 is a terminal group.
Dependencies are inferred from the claim text.