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US 6,449,828 B2Granted
Method of producing a surface acoustic wave component
AssigneeSiemens Matsushita Components GmbH & Co. KG
InventorsWolfgang Pahl, Alois Stelzl, Hans Krüger
Life of this patent
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Abstract
A method of making a SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which is then reinforced with current-less or galvanic deposition.
Claims2
A method of producing a surface acoustic wave component, which comprises:
- providing a substrate and forming electrically conductive SAW structures on the substrate, encapsulating and sealing the structures against environmental influences with a cap cover;
- and
- forming an RF-shielding metallization on the cap cover, by initially vapor-depositing a material layer sequence of TiW, Cu or Ni and Au, and then reinforcing a metal onto said material layer sequence formed on the cap cover with a process selected from the group consisting of a current-less process and a galvanic process.
Dependencies are inferred from the claim text.