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US 6,448,303 B1Granted
Hot melt adhesives for dermal application
AssigneeNational Starch and Chemical Investment Holding Corporation
InventorCharles W. Paul
Life of this patent
Estimating the term…
Abstract
A pressure sensitive hot melt adhesive composition which comprises a high molecular weight rubber and less than about 60 parts by weight of a liquid diluent, and has a G′ of less than about 15×104 dynes/cm2 at 10 rad/s at 25° C. is useful for adhesive skin application (e.g., surgical tape), including transdermal drug delivery applications.
Claims20
An pressure sensitive hot melt adhesive composition comprising a high molecular weight rubber and less than about 60 parts by weight of a liquid diluent, and having a G′ of less than 15×104 dynes/cm2 at 10 rad/s at 25° C.
Dependencies are inferred from the claim text.