Security thread and method and apparatus for applying same to a substrate
AssigneeAgra Vadeko Inc.
InventorsJohn Nicholas Disano, Nigel P. W. Walsh, Tom D. Brett
Life of this patent
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AssigneeAgra Vadeko Inc.
InventorsJohn Nicholas Disano, Nigel P. W. Walsh, Tom D. Brett
Estimating the term…
Applied to a substrate such as paper banknotes is a thread which includes a PET carrier layer with release layers on both surfaces of the carrier layer, and a metallic layer outward of one release layer. An adhesive layer lies outward of the metallic layer. When a substrate is brought into contact with the adhesive layer, the result is to bond the metallic layer to the substrate. Following this, the PET carrier layer is peeled away, leaving the metallic layer bonded to the substrate. An apparatus for accomplishing these steps includes means for bringing the substrate into contact with the adhesive layer, and means for peeling the PET carrier layer away so that it separates from the metallic layer at the adjacent release layer.
A method of securing a metallic layer to a banknote, comprising:
Dependencies are inferred from the claim text.