Optical interconnection apparatus and method of fabricating same

#This invention generally relates to the art of optical fibers and, particularly, to an optical fiber interconnection apparatus and a method of fabricating the apparatus.

#Fiber optics are being used in electronic systems with ever-increasing frequency and intensity, because optical fibers can transmit much greater quantities of information than electrical conductors. In increasing numbers of applications, an optical as well as electrical interconnection is desirable between circuit components. Electrical energy is translated to optical energy which is transmitted by an optical fiber or fibers between electronic components, such as printed wiring or circuit boards. One of the problems with using optical fibers is that they are extremely small and difficult to handle. A typical fiber may be an acrylic coated glass fiber having a total outside diameter of 250 microns. These tiny fibers are fragile and cannot withstand abrupt turns or the like. Consequently, it has become known to bond the fibers to flat flexible substrates to form what is called an optical backplane. The present invention is directed to improvements in optical fiber interconnection apparatus or backplanes to address the problems of handling or manipulating optical fibers in interconnection systems.

#An object, therefore, of the invention is to provide a new and improved optical fiber interconnection apparatus.

#The features of this invention which are believed to be novel are set forth with particularity in the appended claims. The invention, together with its objects and the advantages thereof, may be best understood by reference to the following description taken in conjunction with the accompanying drawings, in which like reference numerals identify like elements in the figures and in which:

#FIGS. 1-4 are plan views representing some of the steps in the method of fabricating the optical fiber interconnection apparatus of the invention;

#FIG. 5 is a fragmented section through one embodiment of the interconnection apparatus;

#Referring to the drawings in greater detail, and first to FIGS. 1-4, the optical fiber interconnection apparatus, generally designated 10 (FIG. 4), of the invention will be described in conjunction with the method of fabricating the apparatus. This will provide a clear and concise understanding of the structure of interconnection apparatus 10 by proceeding sequentially through the steps of fabricating the apparatus.

#With that understanding, the first step in fabricating optical fiber interconnection apparatus 10 is to provide a flat release substrate 12 as shown in FIG. 1. The substrate is covered with a “low tack” adhesive to, in essence, provide a release sheet upon which interconnection apparatus 10 can be fabricated and from which the apparatus can be removed. The substrate may be formed by a polyester sheet which is inexpensive so that it can be discarded after fabricating a single apparatus 10.

#A flat flexible body member 14 then is adhered to substrate 12 as shown in FIG. 2. The flat flexible body member is a flexible polymer sheet, such as of polyimide material. The body member is generally rectangular as defined by a peripheral edge 16 void of any projections. The body member is coated with a pressure sensitive adhesive, such as acrylic adhesive typically applied to coated release paper. This adhesive requires the application of some pressure for adhesion and, therefore, is easier to work with than conventional adhesives.