Micro-alignment of optical components

#The present invention relates generally to optical devices and, more particularly, to optical assemblies and associated methods for aligning optical components with respect to a light path.

#Recent developments in optical communication systems have given rise to miniaturized optical devices that include very small optical components, most of which must be aligned to micron-scale tolerances. For example, in an optical transmitter for optical communications, the output from a light source, such as a laser diode chip, is focused through a lens and coupled into an optical fiber. If a single mode fiber is used in this exemplary optical transmitter, a displacement of the optical fiber by one micron from the ideal aligned position with respect to the laser diode and lens may result in a 50% or more reduction in the optical intensity coupled into the optical fiber. Therefore, the precise alignment of optical components within the miniaturized optical devices is crucial. Furthermore, once the optical components are aligned with respect to each other, it must be possible to secure the optical components in their aligned positions.

#Currently, several techniques are available in the alignment and affixation of optical components in miniaturized optical devices. For instance, the optical components may be manually moved into position then fixed onto a mounting pad by using an adhesive or by laser welding, in the case of metalized optical components or, for example, an optical fiber held in a metal sleeve or jacket. The alignment of optical components is generally performed in one of two ways: passive alignment or active alignment.

#The present invention may be understood by reference to the following detailed description taken in conjunction with the drawings briefly described below.

#FIG. 1 is a diagrammatic plan view of one embodiment of an optical component micro-alignment assembly manufactured in accordance with the present invention shown here to illustrate a possible arrangement of a substrate including a compliant lever.

#FIG. 1A is a cross-section taken through line A—A of FIG. 1.

#The following description is presented to enable one of ordinary skill in the art to make and use the invention and is provided in the context of a patent application and its requirements. Various modifications to the described embodiments will be readily apparent to those skilled in the art and the generic principles herein may be applied to other embodiments. Thus, the present invention is not intended to be limited to the embodiment shown but is to be accorded the widest scope consistent with the principles and features described herein.

#Turning now to the drawings, wherein like components are indicated by like reference numbers throughout the various figures, attention is immediately directed to FIG. 1, which illustrates one embodiment of a micro-alignment assembly, generally indicated by the reference number 10, for the alignment of optical components. Micro-alignment assembly 10 includes a substrate 20. Substrate 20, in this example embodiment, is fabricated from a semiconductor material such as, for example, silicon.

#A compliant lever arm 21 is integrally formed from substrate 20 such that substrate 20 is divided into the compliant lever arm 21 and a primary substrate portion 24, which is defined in the remainder of the substrate. Compliant lever arm 21 includes a component mounting area 22 and a resilient section 26. Component mounting area 22 is configured such that an optical component, for example an end of an optical fiber, fiber grating, microlens, or laser chip, is mountable on component mounting area 22. In the embodiment illustrated in FIG. 1, an optical fiber 30 with a lensed tip 31 is attached to component mounting area 22 by clips 32. Component mounting area 22 includes a V-groove 34 which is designed to accommodate and generally position optical fiber 30 in a predetermined location on component mounting area 22.