Method of extending life expectancy of surface mount components
AssigneeDelphi Technologies, Inc.
InventorMahesh K. Chengalva
Life of this patent
Estimating the term…
Abstract
A method of improving the life expectancy of surface mount components is electronic assemblies wherein a distance between the printed circuit board and the surface mount component is held to a predetermined distance defined as the stand-off height. The relationship between the stand-off height and the life expectancy of the component is directly proportional. A larger stand-off height translates into a longer life expectancy. The stand-off height is limited only by manufacturing constraints, such as process limitations and cost concerns. The stand-off height is set to a predetermined dimension by way of a spacer positioned between the surface mount component and the printed circuit board.
Claims9
A method of extending the life expectancy of a surface mount component printed on a circuit board, said method comprising the steps of:
- temporarily mounting a plastic spacer to said printed circuit board, said plastic spacer being temporarily fixed to said printed circuit board and having a predetermined height dimension between said surface mount component and said printed circuit board;
- and
- soldering said surface mount component to said printed circuit board with at least two solder joints whereby said surface mount component is spaced a predetermined distance from said printed circuit board, said spacer being temporarily fixed to said printed circuit board for maintaining said predetermined height dimension and preventing secondary stresses in said at least two solder joints.
A method of spacing a surface mount component to a predetermined stand-off height from a printed circuit board, said method comprising the steps of:
- temporarily attaching a plastic to said printed circuit board, said plastic spacer being temporarily fixed to said printed circuit board and having a predetermined height between said printed circuit board and said surface mount component, said spacer being positioned between at least two solder pads spaced a distance from each other;
- and
- soldering said surface mount component to said at least two solder pads such that said spacer being temporarily fixed to said printed circuit board defines said predetermined stand-off height between said surface mount component and said printed circuit board thereby preventing secondary stresses in said at least two solder pads.
An electronic assembly comprising:
- at least one surface mount component from the group consisting of a chip resistor;
- a chip capacitor;
- a transistor;
- an integrated circuit;
- a printed circuit board;
- at least two pads at each end of said surface mount component between said surface mount component and said printed circuit board;
- a spacer positioned between said at least two pads below said surface mount component and above said printed circuit board, said spacer having a predetermined height;
- a solder joint at said at least two pads for affixing said surface mount component to said printed circuit board;
- and
- whereby said predetermined height defines a stand-off height between said surface mount component and said printed circuit board.
Dependencies are inferred from the claim text.