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US 6,445,265 B1Granted
Device with acoustic waves guided in a fine piezoelectric material film bonded with a molecular bonding on a bearing substrate and method for making same
AssigneeThomson-CSF
InventorPeter Wright
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Abstract
A surface acoustic wave device including a thin layer of piezoelectric material, a layer of molecular bonder, and a carrier substrate. The thin layer constitutes an acoustic energy guide that augments the performance characteristics of the device. A method for making the acoustic wave device includes a step of molecular bonding between a carrier substrate and a piezoelectric substrate, and then a step for reducing the thickness of the piezoelectric substrate.
Claims14
Surface acoustic wave device comprising:
- means for creating surface acoustic waves;
- a thin layer of piezoelectric material in which the acoustic waves are guided;
- a carrier substrate;
- and
- a layer of molecular bonder by which the thin layer of piezoelectric material is bonded to the carrier substrate, wherein the means for creating surface acoustic waves is located in a central part of the piezoelectric material, and the carrier substrate is hollowed out in front of said central part.
2 more elements
Method for the manufacture of an acoustic wave device comprising:
- implanting ions in a substrate of piezoelectric material at a depth d with respect to a first face of the substrate of piezoelectric material;
- depositing a layer of molecular bonder to the first face of the substrate of piezoelectric material;
- joining a carrier substrate to the layer of molecular bonder on the piezoelectric material under a wet atmosphere so as to carry out a hydrophilic bonding operation;
- fast heating the assembly formed by the carrier substrate, the layer of molecular bonder and the piezoelectric material substrate so as to crack the piezoelectric material substrate at the depth of ion implantation and define the thin layer of piezoelectric material;
- and
- polishing the thin layer of piezoelectric material.
3 more elements
Dependencies are inferred from the claim text.