Method and apparatus for determining yield impacting tests at wafer level package level for semiconductor devices

Abstract

A method for processing semiconductor wafers includes forming a plurality of wafers each comprising a plurality of dies, performing a plurality of tests on the dies to determine good dies and failed dies, and packaging the good dies. The tests are performed on the good dies after packaging to determine good packaged dies and failed packaged dies. A determination is made as to which tests indicate both failed dies and failed packaged dies so that corrective action may be taken. A database is formed to include test data collected at wafer level on dies before they are packaged, and test data collected at package level after the good dies have been packaged. The database and the results of the test comparisons are made available via the Internet so that other facilities processing the same type devices can review and compare the information to their own data. A global or worldwide monitoring of the test data is thus made available.

Dependencies are inferred from the claim text.