IC package testing device and method for testing IC package using the same
AssigneeNEC Machinery Corporation
InventorsJun Simizu, Akio Horimoto
Life of this patent
Estimating the term…
Abstract
Coordinate data for the array pattern of contact pins and coordinate data for the array pattern of solder balls of an IC package is stored by a positioning section of an IC package testing device. The position of a BGA is adjusted so that the contact pins and the solder balls accurately overlap each other. The solder balls of the IC package are abutted on the respective contact pins while the IC package is sucked onto by a suction head. Then, the solder balls are abutted on the respective contact pins with an optimal load while measuring a load applied to the IC package by load cells.
Claims20
An IC package testing device, comprising:
- a measuring unit having a socket including contact pins to contact with solder balls in an IC package for measuring electrical characteristics of the IC package, said measuring unit located at a first location;
- a camera unit located at a second location for imaging a positional pattern of the solder balls in the IC package;
- an image recognition unit which recognizes an image obtained by the camera unit, processes the image, and obtains a positional pattern data of the solder balls;
- a first memory unit for storing the pattern data of the solder balls;
- a second memory unit for storing a positional pattern data of the contact pins in the socket, as provided by a preparation (calibration) process to translate said positional pattern data of the contact pins located at said first location relative to said second location;
- an adjusting unit for adjusting a position of the IC package so as to align the positional pattern of the solder balls with the positional pattern of the contact pins at a positioning section located at said second location;
- and
- a carrier unit for holding the IC package which has been adjusted the position thereof at the positioning section, and carrying it from said second location to the socket at said first location and contacting the solder balls on the contact pins.
A method for testing an IC package on a test apparatus having a socket located at a first position, said socket having contact pins corresponding to solder balls in said IC package, said method comprising:
- imaging and recognizing a positional pattern of the solder balls in the IC package by a camera section located at a second position;
- storing said positional pattern data of the solder balls in the IC package;
- storing a positional pattern data of the contact pins in the socket, as provided by a preparation (calibration) process to translate said positional pattern data of the contact pins located at said first position relative to said second position;
- adjusting a position of the IC package so as to align the positional pattern of the solder balls with the positional pattern of the contact pins;
- carrying the IC package to the socket located at said first position and contacting the solder balls to the contact pins;
- and
- measuring electrical characteristics of the IC package after contacting the solder balls on the contact pins.
An apparatus to test an integrated circuit (IC) package containing an IC circuit and a pattern of solder balls to interface said IC circuit to an external circuit, said apparatus comprising:
- a socket containing contact pins which correspond to a set of solder balls on an IC package undergoing testing;
- a measurement unit to measure at least one characteristic of said circuit when said IC package undergoing testing is fitted into said socket to bring contact pins of said IC package undergoing testing into contact with said contact pins of said socket;
- a memory containing a positional data of said contact pins of said socket, said positional data obtained by a calibration process;
- and
- an adjuster to align a position of said IC package undergoing testing so that the pattern of solder balls on said IC package undergoing testing aligns to said calibration positional data.
A method of testing an IC package containing an IC circuit and a pattern of solder balls to interface said IC circuit to an external circuit, said method comprising:
- placing a calibration jig in a predetermined orientation relative to a socket containing contact pins corresponding to a pattern of solder balls on an IC package undergoing testing, said calibration jig containing a set of recognition marks located in a predetermined orientation relative to said contact pins of said socket;
- inputting, into an image processor, an image of said calibration jig placed at said predetermined orientation;
- calculating a calibration positional data of said contact pins based on said image of said calibration jig;
- inputting, into an image processor, an image of a pattern of solder balls of an IC package undergoing testing;
- calculating from said image of said IC package undergoing testing a current orientation of said IC package undergoing testing and a correction needed to align said current orientation with said calibration positional data;
- reorienting said IC package undergoing testing according to said correction;
- moving said IC package undergoing testing into said socket;
- and
- taking at least one measurement for said IC package undergoing testing.
Dependencies are inferred from the claim text.