US 6,445,076 B1 · Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same

Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same

AssigneesHitachi Chemical Company, Ltd., Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.

InventorsTakehiro Shimizu, Takafumi Dohdoh, Kazumi Tameshige, Hidekazu Matsuura, Yoshihiro Nomura, Kunihiro Tsubosaki, Toshihiro Shiotsuki, Kazunari Suzuki, Tomoko Higashino

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Abstract

An insulating adhesive for electronic parts, which is to be used for bonding a semiconductor chip to a lead frame and comprises a resin and a solvent, the resin having (A) a weight average molecular weight (Mw) of 30,000 to 300,000 based on conversion into polystyrene and (B) a ratio of weight average molecular weight (Mw)/number average molecular weight (Mn) of 5 or less, and (C) the insulating adhesive for electronic parts having a viscosity of 5,000 to 100,000 mPa.s at a rotation number of 10 rpm and a viscosity ratio (η1 rpm/η10 rpm) of 1.0 to 6.0 as measured at 25° C. with an E-type viscometer.

Claims13

Dependent claims

An insulating adhesive for an electronic part, which is to be used for bonding a semiconductor chip to a lead frame and comprises a resin and a solvent, the resin having

(A) a weight average molecular weight (Mw) of 30,000 to 300,000 based on conversion into polystyrene and
(B) a ratio of weight average molecular weight (Mw)/number average molecular weight (Mn) of 5 or less, and
(C) the insulating adhesive for an electronic part having a viscosity of 5,000 to 100,000 mPa.s at a rotation number of 10 rpm and a viscosity ratio (η1 rpm/η10 rpm) of 1.0 to 6.0 as measured at 25° C. with an E-type viscometer.

Dependencies are inferred from the claim text.