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US 6,445,064 B1Granted
Semiconductor device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsHideki Ishii, Kazunari Michii, Jun Shibata, Moriyoshi Nakashima
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Abstract
A semiconductor device includes a first semiconductor package and a second semiconductor package which is mounted onto the first semiconductor package. The first semiconductor package has lands on an upper surface for mounting the second semiconductor package and lands on the lower surface for external connection, which are used for connection with a mounting substrate. The second semiconductor package has external leads which are connected to the lands for mounting the second semiconductor package.
Claims13
A semiconductor device comprising:
- a first semiconductor package including:
- a substrate having a first surface and a second surface;
- a first semiconductor chip bonded to the first surface of said substrate, said chip having a plurality of bonding pads;
- lands for mounting located on the first surface of said substrate,
- lands for wire bonding located on the first surface of said substrate and electrically connected to respective bonding pads of said first semiconductor chip;
- a first group of lands for external connection located on the second surface of said substrate and electrically connected to respective lands for mounting;
- a second group of lands for external connection located on the second surface of said substrate and electrically connected to respective lands for wire bonding;
- and
- a second semiconductor package including:
- a second semiconductor chip having a plurality of bonding pads;
- and
- external leads electrically connected to respective bonding pads of said second semiconductor chip and electrically connected to respective lands for mounting on the first surface of said substrate.
9 more elements
Dependencies are inferred from the claim text.