US 6,445,062 B1 · Semiconductor device having a flip chip cavity with lower stress and method for forming same

Abstract

There is provided a semiconductor device including (a) a substrate, (b) a semiconductor chip mounted on the substrate, (c) a wall having a closed cross-section and mounted on the substrate such that the semiconductor chip is surrounded by the wall, and (d) a cover covering the wall therewith so that a closed cavity is defined by the substrate, the wall and the cover, the cavity being designed to be under a pressure almost equal to an atmospheric pressure at a temperature highest in both steps of fabricating the semiconductor device and steps expectable after the semiconductor device is completed. The semiconductor device can prevent defectiveness such as electric leakage and electromigration, and further prevent occurrence of “popcorn” phenomenon which might occur in an annealing step.

Claims31

Dependent claims

A semiconductor device comprising:

(a) a substrate;
(b) a semiconductor chip mounted on said substrate;
(c) a wall having a closed cross-section and mounted on said substrate such that said semiconductor chip is substantially surrounded by said wall;
and
(d) a cover attached to a top portion of said wall so that a closed cavity is defined by said substrate, said wall and said cover,
said cavity having a pressure with a predetermined difference between pressures inside and outside said cavity at a predetermined temperature.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor device having a flip chip cavity with lower stress and method for forming same

Life of this patent

Semiconductor device having a flip chip cavity with lower stress and method for forming same

Life of this patent

Abstract

Claims31