Leads under chip in conventional IC package
AssigneeMicron Technology, Inc.
InventorDavid J. Corisis
Life of this patent
Estimating the term…
Abstract
A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a substantially horizontal plane and another portion of the plurality of lead fingers of the lead frame located substantially in the same horizontal plane as the active surface of the semiconductor device. Both pluralities of lead fingers of the lead frame having their ends being located substantially adjacent the peripheral sides of the semiconductor device, rather than at the ends thereof.
Claims31
A semiconductor assembly including:
- a semiconductor device having opposed longer peripheral sides and opposed ends, an active surface in substantially a first horizontal plane, an inactive bottom surface in substantially a second horizontal plane, and a plurality of bonds pads located on the active surface of the semiconductor device, a first portion of the plurality of bond pads located adjacent one of the opposed longer peripheral sides and a second portion of the plurality of bond pads located adjacent another of the opposed longer peripheral sides;
- and
- a lead frame comprising:
- a first plurality of lead fingers extending substantially in the first horizontal plane of the active surface of the semiconductor device, each lead finger of the first plurality of lead fingers terminating in an end located adjacent a longer peripheral side of the opposed longer peripheral sides of the semiconductor device;
- and
- a second plurality of lead fingers extending below the inactive bottom surface of the semiconductor device, each lead finger of the second plurality of lead fingers having a portion thereof extending adjacent an end of the opposed ends of the semiconductor device and terminating in an end located adjacent a longer peripheral side of the opposed longer peripheral sides of the semiconductor device, some of the second plurality of lead fingers forming a die paddle for locating the semiconductor device thereon, a plurality of lead fingers of the second plurality of lead fingers each having a portion thereof extending adjacent a portion of a lead finger of the first plurality of lead fingers, a portion thereof extending substantially adjacent an end of the opposed ends of the semiconductor device, a portion extending substantially opposed to an end of the opposed ends of the semiconductor device and extending adjacent a portion of the die paddle, and having a portion extending beyond a side of the opposed longer peripheral sides of the semiconductor device.
A lead frame for a semiconductor assembly having a semiconductor device having opposed longer peripheral sides, opposed ends, an active surface in substantially a first horizontal plane, an inactive bottom surface in substantially a second horizontal plane, and a plurality of bonds pads located on the active surface of the semiconductor device, a first portion of the plurality of bond pads located adjacent one of the opposed longer peripheral sides and a second portion of the plurality of bond pads located adjacent another of the opposed longer peripheral sides, said lead frame comprising:
- a first plurality of lead fingers extending substantially in the first horizontal plane of the active surface of the semiconductor device, each lead finger of the first plurality of lead fingers terminating in an end located adjacent a longer peripheral side of the opposed longer peripheral sides of the semiconductor device;
- and
- a second plurality of lead fingers extending below the inactive bottom surface of the semiconductor device, each lead finger of the second plurality of lead fingers having a portion thereof extending adjacent an end of the opposed ends of the semiconductor device and terminating in an end located adjacent the longer peripheral side of the opposed longer peripheral sides of the semiconductor device, at least one lead finger having a portion thereof extending adjacent a portion of a lead finger of the first plurality of lead fingers, a portion thereof extending substantially adjacent an end of the opposed ends of the semiconductor device, a portion extending substantially opposed to an end of the opposed ends of the semiconductor device, and having a portion extending beyond a side of the opposed longer peripheral sides of the semiconductor device.
A lead frame for a semiconductor assembly having a semiconductor device having opposed longer peripheral sides, opposed ends, an active surface in substantially a first horizontal plane, an inactive bottom surface in substantially a second horizontal plane, and a plurality of bonds pads located on the active surface of the semiconductor device, a first portion of the plurality of bond pads located adjacent one of the opposed longer peripheral sides and a second portion of the plurality of bond pads located adjacent another of the opposed longer peripheral sides, said lead frame comprising:
- a first plurality of lead fingers extending substantially in the first horizontal plane of the active surface of the semiconductor device, each lead finger of the first plurality of lead fingers terminating in an end located adjacent a longer peripheral side of the opposed longer peripheral sides of the semiconductor device;
- and
- a second plurality of lead fingers extending below the inactive bottom surface of the semiconductor device, some of the second plurality of lead fingers forming a die paddle for locating the semiconductor device thereon, a plurality of lead fingers of the second plurality of lead fingers each having a portion thereof extending adjacent a portion of a lead finger of the first plurality of lead fingers, a portion thereof extending substantially adjacent an end of the opposed ends of the semiconductor device, a portion extending substantially opposed to an end of the opposed ends of the semiconductor device and extending adjacent a portion of the die paddle, and having a portion extending beyond a side of the opposed longer peripheral sides of the semiconductor device.
Dependencies are inferred from the claim text.