Coated semiconductor die/leadframe assembly and method for coating the assembly

A die package, comprising:

• a die;
• a lead frame supporting said die and comprising:
• a plurality of lead fingers, wherein each lead finger of said plurality has a first portion and a second portion;
• an adherent contacting said die and further contacting all of said first portion to the exclusion of said second portion of said each lead finger of said plurality;
• and
• a mold around said first portion of said each lead finger of said plurality.

A semiconductor device, comprising:

• a lead frame having a lead finger, wherein said lead finger has a first portion;
• a die mounted on said lead frame;
• a protective layer over said die and extending over said first portion of said lead finger;
• and
• a mold compound around said die, wherein said mold compound is also around said first portion of said lead finger to a degree coextensive with said protective layer, said protective layer having a smoothly contoured outside surface shaped so that an intersection between said surface of said protective layer and a surface of said mold compound is non-rectilinear.

A lead-on-chip package, comprising:

• a lead frame comprising a plurality of lead fingers;
• a die directly contacting said plurality of lead fingers;
• an adhesive around said die and around a portion of each lead finger of said plurality of lead fingers;
• and
• a mold around said adhesive.

A die assembly, comprising:

• a die having a first side containing an electrical contact node and a second side parallel to said first side;
• a lead frame comprising a lead finger in electrical communication with said electrical contact node;
• a failure prevention layer over said die and extending over said lead frame;
• and
• a body extending over all of said failure prevention layer, said failure prevention layer having a smoothly contoured outside surface shaped so that an intersection between said surface of said failure prevention layer and a surface of said body is non-rectilinear.

A die/leadframe assembly, comprising:

• a plurality of lead fingers defining a plane;
• a die electrically coupled to said plurality of lead fingers;
• a delamination prevention layer on said die and extending along said plane onto said plurality of lead fingers;
• and
• a packaging material extending along said plane onto all of said delamination prevention layer.

An in-process semiconductor device, comprising:

• a leadframe;
• a die comprising a bond pad surface and an opposite surface, wherein said leadframe and a selection of said bond pad surface and said opposite surface define an exposed portion of said device;
• a first adhesive layer mounting said die to said leadframe;
• and
• a second adhesive layer over said exposed portion of said device.

A circuit package, comprising:

• an electrically conductive portion, comprising:
• a leadframe, and
• a die mounted on said leadframe;
• and
• an electrically non-conductive portion comprising:
• an adhesive protection layer around said die and partially around said leadframe, and
• a body around said die, partially around said leadframe and around at least a portion of said adhesive protection layer.