Photo sensing device and the manufacturing method thereof
AssigneeOpto Tech Corporation
InventorsMing-Der Lin, Feng Ju Chuang, Wen Liang Tseng, Chia Chen Chang
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Abstract
A photo sensing device uses surface-emitting LED as light emitter to increase responsive of light receiver and prevent the short circuit of connection wires, and the manufacturing method thereof. The light emitter is directly mounted on top front surface of an encapsulating epoxy enclosing a light receiver. The light emitted from backside of the light emitter passes through the encapsulating epoxy and is directly absorbed by the light receiver. The response is enhanced as compared with prior art.
Claims34
A photo sensing device comprising:
- at least one light receiver each arranged on a first inner lead of a leadframe;
- the light receiver having an anode and a cathode connected to a second inner lead and a third inner lead through conductive wires;
- an encapsulating epoxy enclosing the light receiver;
- and
- a light emitter arranged on front top surface of the encapsulating epoxy;
- the light emitter having an anode and a cathode connected to a fifth inner lead and a sixth inner lead through conductive wires;
- the light emitted from a backside of the light emitter passing through the encapsulating epoxy and detected by the light receiver.
A method for manufacturing a photo sensing device, comprising following steps:
- (a) mounting a light receiver on a first inner lead of a leadframe and connecting an anode and a cathode of the light receiver to a second inner lead and a third inner lead of the leadframe by connection wires;
- (b) providing an encapsulating epoxy enclosing the light receiver and the connection wires;
- (c) providing a light emitter on top front surface of the encapsulating epoxy;
- (d) connecting an anode and a cathode of the light emitter to a fifth inner lead and a sixth inner lead of the leadframe by connection wires.
A method for manufacturing a photo sensing device, comprising following steps:
- (a) mounting a light receiver on a first inner lead of a leadframe;
- (b) providing a light emitter with a binding layer attached on bottom thereof;
- (c) arranging the light emitter with the binding layer on top front surface of the light receiver;
- and
- (d) connecting an anode and a cathode of the light emitter to a fifth inner lead and a sixth inner lead of the leadframe by connection wires;
- and connecting an anode and a cathode of the light receiver to a second inner lead and a third inner lead of the leadframe by connection wires.
Dependencies are inferred from the claim text.