Apparatus and method for detecting electromagnetic radiation using electron photoemission in a micromechanical sensor
AssigneeUT-Battelle, LLC
InventorsPanagiotis G. Datskos, Slobodan Rajic, Irene C. Datskou, Charles M. Egert
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Abstract
A micromechanical sensor and method for detecting electromagnetic radiation involve producing photoelectrons from a metal surface in contact with a semiconductor. The photoelectrons are extracted into the semiconductor, which causes photo-induced bending. The resulting bending is measured, and a signal corresponding to the measured bending is generated and processed. A plurality of individual micromechanical sensors can be arranged in a two-dimensional matrix for imaging applications.
Claims29
A method for detecting electromagnetic radiation, comprising the steps of:
- directing electromagnetic radiation onto a material in contact with a deflectable structure comprised of a semiconductor to cause said material to emit photoelectrons which are absorbed by said deflectable structure so as to cause photo-induced bending of the deflectable structure;
- and
- measuring the photo-induced bending of the deflectable structure.
An apparatus for detecting electromagnetic radiation, comprising:
- emitting means operative upon being exposed to electromagnetic radiation for emitting photoelectrons;
- absorbing means for absorbing photoelectrons emitted by said emitting means, said absorbing means exhibiting a dimensional change in response to absorbing said emitted photoelectrons;
- means for dimensionally constraining a surface of said absorbing means, whereby when said absorbing means exhibits said dimensional change, said absorbing means deflects;
- and
- means for sensing the deflection of said absorbing means;
- whereby when said means for sensing the deflection of said absorbing means senses a deflection of said absorbing means, the presence of electromagnetic radiation is indicated.
An imaging apparatus for electromagnetic radiation, comprising:
- a plurality of micromechanical sensors disposed in a two-dimensional array, each of said micromechanical sensors comprising a first layer of semiconductor material and a second layer of a material which emits photoelectrons when exposed to electromagnetic radiation and which dimensionally constrains a surface of said first layer, said first layers of said micromechanical sensors absorbing photoelectrons emitted by said second layers of said micromechanical sensors and undergoing a dimensional change in response thereto, said second layer dimensionally constraining a surface of said first layer such that said micromechanical sensor bends in response to a dimensional change in said first layer;
- for each of said plurality of micromechanical sensors, a means for sensing bending of an associated micromechanical sensor and for generating an output signal;
- and
- means for processing said output signals from said sensing means and for outputting an image onto a display device.
Dependencies are inferred from the claim text.