Method and apparatus for controlling plasma flow
AssigneeGeoMat Insights, LLC
InventorRonald J. Barnett
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Abstract
A method and apparatus for simultaneously cleaning and bonding a wire to a bonding surface is presented. In accordance with the invention, a gas is energized to form a plasma, which is then directed in a directional pressurized flow at the wire and bonding surface to form a dynamic plasma cleaning chamber bubble around the portion of the wire and bonding surface that are to be bonded together, and then the respective portions of the wire and bonding surface are bonded together within the plasma cleaning chamber bubble.
Claims15
A method for monitoring the temperature of a plasma, said plasma alone directed in a directional pressurized flow at a bonding surface, said method comprising:
- sensing a temperature related to a bonding surface temperature of said bonding surface;
- and
- modulating said directional pressurized flow of said plasma alone in response to said sensed temperature.
A temperature modulation device for a plasma gun that generates and directs only a pressurized directional flow of a plasma at a surface to be bonded, comprising:
- a temperature sensor which senses a temperature related to a bonding surface temperature of said bonding surface;
- and
- a controller which modulates only said pressurized directional flow of said plasma in response to said sensed temperature.
A plasma gun, comprising:
- an energizing circuit that ionizes a gas to produce a plasma;
- a nozzle that directs only a pressurized directional flow of said plasma at a surface to be bonded;
- a temperature sensor which senses a temperature related to a bonding surface temperature;
- and
- a controller which modulates only said pressurized directional flow of said plasma in response to said sensed temperature.
Dependencies are inferred from the claim text.