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US 6,444,923 B1Granted
Method of connecting printed wiring boards with each other, and printed circuit board
AssigneeFujitsu Limited
InventorsShigeo Iriguchi, Satoshi Watanabe, Yoshitaka Muraoka
Life of this patent
Estimating the term…
Abstract
At one end of a printed wiring board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. At one end of an FPC which is to be connected with the printed circuit board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. The engagement patterns in the printed wiring board being engageable with the engagement patterns in the FPC. When the two engagement patterns are engaged with each other, the electrode pattern of the printed wiring board is electrically connected with the electrode pattern of the FPC.
Claims12
A method of connecting between printed wiring boards comprising:
- a first process of forming a first electrode pattern at one end of a first printed wiring board and forming a first engagement pattern near the first electrode pattern, said first engagement pattern being made of the same material as that of the first electrode pattern and formed by the same process as that of the first electrode pattern;
- a second process of forming a second electrode pattern at one end of a second printed wiring board and forming a second engagement pattern near the second electrode pattern, said second engagement pattern being made of the same material as that of the second electrode pattern of be and formed by the same process as that of the second electrode pattern, said second engagement pattern being engageable with said first engagement pattern;
- and
- a positioning step of engaging said first engagement pattern with said second engagement pattern so that
- said first electrode pattern and said second electrode pattern are positioned to have an electrical connection with each other, and
- said engagement patterns, made of the same material and formed by the same process as that of the electrode patterns, are the sole means of aligning the first printed wiring board with the second printed wiring board.
3 more elements
A method of connecting between printed wiring boards comprising:
- a first plating step of forming first plated patterns by plating on a part of first electrode patterns at one end of a first printed wiring board, thereby forming first non-plated parts on the other part of said first electrode patterns;
- a second plating step of forming second plated patterns by plating on a part of second electrode patterns at one end of a second printed wiring board, thereby forming second non-plated parts on the other part of said second electrode patterns;
- and
- a positioning step of engaging said first plated patterns with said second non-plated parts and engaging said second plated patterns with said first non-plated parts.
1 more element
A method of connecting between printed wiring boards, comprising:
- a first covering-material forming step of forming a covering material at one end of a first printed wiring board, which covering material covers an upper surface of said first printed wiring board other than a portion of the surface where a first electrode pattern is electrically connected so that one end of the covering material positioned at said first electrode pattern side has a first rugged part in a direction parallel with the surface of said first printed wiring board;
- a second covering-material forming step of forming a covering material at one end of a second printed wiring board, which covering material covers an upper surface of said second printed wiring board other than a portion of the surface where a second electrode pattern is electrically connected so that one end of the covering material positioned at said second electrode pattern side has a second rugged part in a direction parallel with the surface of said second printed wiring board;
- and
- a positioning step of engaging said first rugged part with said second rugged part to position said electrode patterns so that the first electrode pattern is electrically connected with the second electrode pattern.
1 more element
Printed circuit boards comprising:
- a first engagement pattern provided near a first electrode pattern on a first printed circuit board, said first engagement pattern being made of the same material as that of said first electrode pattern;
- and
- a second engagement pattern provided near a second electrode pattern on a second printed circuit board, said second engagement pattern being made of the same material as that of said second electrode pattern, and said second engagement pattern being engageable with said first engagement pattern,
- wherein said first engagement pattern is engaged with said second engagement pattern so that said first electrode pattern is electrically connected with said second electrode pattern.
1 more element
Printed circuit boards comprising:
- first plated patterns provided by plating on a part of first electrode patterns on a first printed circuit board, thereby automatically forming first non-plated parts on the other part of said first electrode patterns;
- and
- second plated patterns provided by plating on a part of second electrode patterns on a second printed circuit board, thereby automatically forming second non-plated parts on the other part of said second electrode patterns,
- wherein said first plated patterns are engaged with said second non-plated parts and said second plated patterns are engaged with said first non-plated parts.
1 more element
Printed circuit boards comprising:
- a first printed wiring board covered with a covering material that covers an upper surface of said first printed wiring board other than a portion of the surface where a first electrode pattern is electrically connected, with one end of the covering material positioned at said first electrode pattern side having a first rugged part in a direction parallel with the surface of said first printed wiring board;
- and
- a second printed wiring board covered with a covering material that covers an upper surface of said second printed wiring board other than a portion of the surface where a second electrode pattern is electrically connected, with one end of the covering material positioned at said second electrode pattern side having a second rugged part in a direction parallel with the surface of said second printed wiring board,
- wherein said first rugged part is engaged with said second rugged part so that said first electrode pattern is electrically connected with said second electrode pattern.
1 more element
Dependencies are inferred from the claim text.